Interview Questions
Manufacturing, Packaging & Test (ATMP)
Assembly, test, packaging & yield engineering
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Interview process
ATMP loops open with a resume-led hiring-manager round, then technical rounds that weight packaging/test design and yield/production reasoning. Packaging/test and yield carry the most weight (~60% combined).
5 roundsHiring manager round → Packaging & test design round → Yield & production round …
Question bank by sub-domain
Pick a sub-domain to study leveled questions, each tagged with the companies that ask it.
ATMP
Assembly
Die attach, wire-bond, flip-chip
0 questions
ATMP
Packaging
BGA, 2.5D/3D, interposers, warpage
0 questions
ATMP
ATE Test
Test program, load board, handlers
0 questions
ATMP
Burn-in / Reliability
HTOL, ESD, latch-up
0 questions
ATMP
Yield & Binning
Bin maps, guardbands
0 questions
ATMP
Thermal
Junction temp, TIM, dissipation
0 questions
ATMP
Characterization
Corner lots, shmoo, margining
0 questions